§ Funding Round
Rapidus - Grant: $5.9B in additional Japanese government subsidies, taking total state investment to $16.3B for the 2nm chipmaker.
Rapidus, the Japanese semiconductor startup building a 2nm chip fabrication facility with IBM technology, received an additional $4B in government subsidies in April 2026. This brought cumulative state investment and fees to approximately $16.3B, underscoring Japan's strategic commitment to domestic chipmaking capability. Rapidus is developing advanced AI chips for customers including Fujitsu, aiming to compete with TSMC and Samsung in leading-edge semiconductor manufacturing.
This company has completed 1 funding round. Current round is highlighted.
Total Raised
$5.9B
Top Valuation
-
Rapidus raised $5.9B in a Grant round.
The round was announced on 04/07/26.
Japan approved an additional $4B in subsidies to Rapidus in April 2026, part of a cumulative $5.9B package taking total state investment and fees to $16.3B for the semiconductor startup working on 2nm chip fabrication.
